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台积电据报酝酿先进封装与晶圆提价,借AI需求测试定价权

MarketBeat·· 4 天前

Taiwan Semiconductor Flexes Pricing Power on AI's Frontline

AI 导读

据MarketBeat报道,行业报告显示台积电正筹备对最先进封装与制造服务进行一系列协同提价,若实施将有助于其将扩产成本向下游转嫁。报道称,台积电先进封装服务价格可能上调10%至20%;2纳米和3纳米等先进制程晶圆价格预计自2027年初起上涨3%至6%。

原文摘录

Taiwan Semiconductor Manufacturing Today TSM Taiwan Semiconductor Manufacturing $432.16 -7.36 (-1.67%) As of 01:34 PM Eastern This is a fair market value price provided by Massive. Learn more. 52-Wee…

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来源:MarketBeat · marketbeat.com